Bar Solder and Related Products
         
Kester makes no vague claims of outstanding solder purity. The quality of Kester Bar and Anode Solder is guaranteed by using virgin metals and strict quality control standards. Kester extrudes its bar and anode products to minimized oxidation, limit segregation and provide a denser grain structure than cast bar. Kester manufactures solder to distinct specifications. Each meets and exceeds requirements of QQ-S-571, ASTM 32, ANSI/J-STD-006, and JIS-Z-3282.
         
Lead-Free Solder Bar
Ultrapure® K100
Kester has developed Ultrapure® K100, a low cost lead-free bar solder. Kester K100 is a near eutectic SnCu alloy with controlled metallic dopants to control the grain structure within the solder joint. This improves reliability of the joint and virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives. Kester K100 compares favorably to low-cost. lead-free alloys of Sn and Cu in terms of wetting and flow characteristics. Kester K100 provides the lowest delivered price to the global market for wave soldering operations. Kester K100 also provides solder joints with no visible shrinkage effects, excellent through-hole penetration and topside fillet, low dissolution of Cu from boards and components into solder pot and low dross rate.


Leaded Rectangle Bar

Lead-Free Triangle Bar

Kester Ultrapure® Solder Bar
Made by a special process which controls the inclusion of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronics applications where lower surface tension and hole filling ability are essential. The purity of Kester Ultrapure® far exceeds the requirements of QQ-S-571-F, ASTM B32, and ANSI/J-STD-006.

 

Kester Ultrapure® Low Dross Solder Bar
Manufactured using the Ultrapure® process and containing the same metal purity as Kester Ultrapure®, Kester Ultrapure® Low Dross is formulated with a special low dross additive which dramatically decreases dross formation onthe solder pot. Lower dross formation decreases joint weakening inclusions in the solder, keeps surface tension low and decreases costly solder loss through drossing.

 

Kester Ultrapure® Solder Anodes

Kester Ultrapure® Anode is made using the highest purest virgin metal. High pressure extrusion and the Ultrapure® process assure all anodes with a dense fine grain structure. They permit higher current densities without passivation, guarantee uniform dissolution, and do not normally require bagging. Kester Ultrapure® Anode is available in 19mm and 25mm with a range of alloy combinations and in half or full spherical.

 

 

Maximum Allowed Impurities
Element Kester Ultrapure® Ultrapure® Low Dross Ultrapure® Anodes JIS Grade E JIS Grade A JIS Grade B ANSI/IPC J-STD-006
Copper Cu 0.015 0.015 0.015 0.050 0.050 0.080 0.080
Gold Au 0.002 0.002 0.002   -   -   - 0.050
Antimony Sb 0.050 0.050 0.050 0.050 .0.120 1.000 *
Cadmium Cd 0.001 0.001 0.001 0.002 0.002 0.005 0.002
Zinc An 0.001 0.001 0.001 0.001 0.002   - 0.003
Aluminum Al 0.002 0.002 0.002 0.001 0.002   - 0.005
Iron Fe 0.010 0.010 0.010 0.020 0.020   - 0.020
Arsenic As 0.020 0.020 0.020 0.030 0.030   - 0.030
Bismuth Bi 0.020 0.020 0.020 0.050 0.100   - 0.100
Silver Ag 0.002 0.002 0.002   -   -   - 0.050
Nickel Ni 0.002 0.002 0.002   -   -   - 0.010
Indium In 0.007 0.007 0.007   -   -   - 0.100
     

Total for Cd+Zn+Al
+Fe+As Max. 0.080

Total for Cd+Zn+Al
+Fe+As Max. 0.080 		Total for Bi+Zn+Fe
+Al+As Max. 0.350 		*For variation A,B and C alloys the Sb maximum is 0.50%, 0.20% and 0.50%
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